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    Faculty Profile — Is this you? Login to edit.Last Modified Time: 04:09:39 PM Wed, 21 May 2014 
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Terry Baughn
Senior Lecturer III-Mechanical Engineering
Office MailstopRoom No.: ECSN 3.908 
Email Address    Primary Phone Number 972-883-3584    Media Contact
 Professional Preparation
 Ph.D.Mechanical & Aerospace EngineeringUniversity of Texas at Dallas1973
 M.S.Aeronautics and Astronautics EngineeringPurdue University1967
 B.S.Aeronautics and Astronautics EngineeringPurdue University1965
Collapse Section Expand Section Research and Expertise
Research Interests

The applied research is focused on the development of a stress limit methodology for the application of Weibull statistics in small volume (micron) devices encountered in the electronics industry. I also have a strong interest in the development and application of the digital image correlation methods for the measurement of material properties and the strain field in extremely small electronic components. Currently, work is underway to measure the strains in the adhesive attachment bond of active and passive electronic devices. 

Collapse Section Expand Section Publications
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  YearPublication  Type
Srinivisan, V., T.V. Baughn, et al., (2005) “High Resolution Characterization of Materials Used in Packages Through Digital Image Correlation”, Proceedings of InterPack 2005, ASME International Electronic and Photonic Packaging Conference, Paper No. IPACK2005-73258, July 17-22, 2005.
Conference paper
Baughn, T.V. and S. Chen, (2003), “Low Cycle Fatigue in RF Microwave Module Housings,” Proceedings of InterPack 2003, ASME International Electronic and Photonic Packaging Conference, Paper No. IPACK2003-35263, July 6-11, 2003.
Conference paper
Chen, S., T.V. Baughn, J. Yao, and C. Goldsmith, (2002), "A New In-Situ Residual Stress Measurement Method For MEMS Suspended Membranes," IEEE/ASME Journal of Microelectromechanical Systems, Volume 11, No. 4, August 2002, pp. 309-316
Peer reviewed
Allen, B., T.V. Baughn, and S. Chen, (2001), "Reliability of Adhesive Bond Joints in Electronic Packaging,” ASME International Electronic and Photonic Packaging Conference, Paper No. IPACK2001-15536, July 8-13, 2001.
Conference paper
Chan, Y.W, M. Wolverton, and T.V. Baughn, (1998), "Computational Analysis Of Flip Chip Bump And Solder Joint Designs," 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 1998 ITherm May 27-30, 1998, pp. 166-170.
Conference paper
Collapse Section Expand Section Appointments
DurationRankDepartment / SchoolCollege / OfficeUniversity / Company
9/73-10/76Senior Project Engineer  General Motors Corporate Engineering Staff
8/82-5/89Associate Professor  Southern Methodist University
8/13-presentSenior Lecturer IIIDepartment in the Erik Jonsson of Engineering and Computer Science University of Texas at Dallas
5/89-2/97 Defense Systems & Electronics Group Texas Instruments
2/97-12/12Raytheon Engineering Fellow  Raytheon Company
2/70-9/73Graduate Student  University of Delaware
2/67-2/70Project Engineer & Plant Engineer  E.I. duPont Commerical Resins Division
10/76-8/82Group Manager & Product Engineer  International Harvester Truck Group
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 Additional Information
Professional Memberships
Professional Registration
Registered Professional Engineer: State of Texas No. 62191
(passed national PE examination in Indiana)
Professional Societies
Society of Automotive Engineers
Member Society of Automotive Engineers 1974-1999
SAE Ft. Wayne Section Offices
Student Activities Chairman 1979
Program Chairman 1980
Treasurer 1981
SAE National Committee on Fatigue Design & Evaluation 1976-1981
American Society of Mechanical Engineers 
Member ASME 1982-present
North Texas Section, Secretary 2005-2006
North Texas Section, Treasurer 2006-2007
North Texas Section, Vice-Chair 2007-2008
North Texas Section, Chair 2008-2009
Southern Methodist University ASME Student Section
Faculty Advisor 1982-1987
North Texas Section, Industry Advisory Board 1987-1991
ASME InterPACK97 Session Chair 1997
ASME InterPACK01 RF Microwave Track Chair 2001
ASME InterPACK01 Session Chair 2001
RF MEMS, Interconnects and Simulation
ASME InterPACK 03 RF Microwave Track Chair 2003
ASME InterPACK 03 Session Chair
RF Microwave Design & Analysis 2003
ASME InterPACK 03 Panel Session Chair 2003
ASME InterPACK 05 Microwave Track Chair 2005
ASME sponsored PE Review Course, lecturer 2002, 03, 04, 05
Machine Design Sections

Honors & Awards
Purdue University Special Merit Scholarship (1960)
Industrial Advisory Board, Center For Composite Materials
University of Delaware (1979)
SAE Award, significant contribution to the 1979 SAE
National Truck Meeting
ASME Outstanding Professor, SMU/ASME (1983)
Best Paper, ASEE Gulf-Southwest Section Annual Conference (1985)
SAE Oral Presentation Award, 1986 Passenger Car Meeting (1986)
Tau Beta Pi, Engineering Honor Society (1987)
SMU, Civil/Mechanical Engineering Department, Outstanding Professor Award For Undergraduate Teaching (1988)
SMU, Civil/Mechanical Engineering Department, Outstanding Graduate Faculty Award (1988)
Elected Member Group Technical Staff, Texas Instruments (1996)
Elected Senior Principal Engineer (with Honors), Raytheon (2001)
ASME, North Texas Section of Electrical and Electronics Packaging  
“Engineer of the Year,” (2001)
Selected as a profiled engineer for Engineering Week 2002 within Raytheon Company, Electronic Systems North Texas (2002)
Promoted to: Raytheon Engineering Fellow, Raytheon (2002)
Elected ASME Fellow (2007)
ASME Scott Kalmus Award, (2010)

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